Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control

US10240248B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Paul Van Valkenburg · Whitefish, US
• Robert Mikkola · Kalispell, US
• John L. Klocke · Kalispell, US
• Paul R. McHugh · Kalispell, US
• Gregory J. Wilson · Kalispell, US
• Kyle M. Hanson · Kalispell, US
• Eric J. Bergman · Kalispell, US

Key dates

• Filing date: Aug 10, 2016
• Grant date: Mar 26, 2019
• Expiry date: Mar 1, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D17/008
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for example the edge of the wafer, from the electric field in the vessel. Selectively shielding may be achieved by temporally shifting the average position of the agitator towards one side of the wafer, by omitting or shortening slots in the agitator, and/or by synchronizing movement of the agitator with rotation of the wafer.