LDMOS transistor and method
US10242932B2 · kind B2 · utility
0Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2016 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jun 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/112
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a semiconductor device includes a semiconductor substrate having a front surface, a LDMOS transistor arranged in the front surface of the substrate and having an intrinsic source, and a through substrate via. A first conductive layer lines sidewalls of the through substrate via and extends from the through substrate via onto the front surface of the semiconductor substrate and is electrically coupled with the intrinsic source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.