Inventor · Regensburg, DE

Matthias Zigldrum

16Patents

2h-index

9Co-inventors

39Inventor score

Filing activity: Aug 2, 2013 → Aug 20, 2020

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9543260B2	Segmented bond pads and methods of fabrication thereof	Electricity	4	Active
US10629575B1	Stacked die semiconductor package with electrical interposer	Electricity	2	Active
US10622284B2	LDMOS transistor and method	Electricity	2	Active
US10629727B2	Method of manufacturing a semiconductor device including an LDMOS transistor	Electricity	1	Active
US10665531B2	LDMOS transistor	Electricity	0	Active
US10020270B2	Semiconductor device including a LDMOS transistor, monolithic microwave integrated circuit and method	Electricity	0	Active
US9634085B1	Semiconductor device including a LDMOS transistor	General	0	Revoked
US10050139B2	Semiconductor device including a LDMOS transistor and method	Electricity	0	Active
US11817482B2	Semiconductor device and method	Electricity	0	Active
US10672686B2	LDMOS transistor and method	Electricity	0	Active
US10410956B2	LDMOS transistor and method	General	0	Revoked
US10242932B2	LDMOS transistor and method	Electricity	0	Active
US10026806B2	Semiconductor device including an LDMOS transistor and a RESURF structure	Electricity	0	Active
US10304789B2	LDMOS transistor structure and method of manufacture	Electricity	0	Active
US10340334B2	Semiconductor device including an LDMOS transistor and a resurf structure	Electricity	0	Active
US9960229B2	Semiconductor device including a LDMOS transistor	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.