Wire bonded wide I/O semiconductor device
US10249592B2 · kind B2 · utility
1Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2018 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Feb 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wide I/O semiconductor device is disclosed including a memory die stack wire bonded to an interface chip. The stack of memory die may be wire bonded to the interface chip using a wire bond scheme optimized for die-to-die connection and optimized for the large number of wire bond connections in a wide I/O semiconductor device. This method can achieve significant BW increase by improving packaging yield and costs, not possible with current packaging schemes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.