Devices and methods for forming cross coupled contacts
US10262941B2 · kind B2 · utility
2Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2016 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Aug 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and methods of fabricating the semiconductor devices with cross coupled contacts using patterning for cross couple pick-up are disclosed. One method includes, for instance: obtaining an intermediate semiconductor device; performing a first lithography to pattern a first shape; performing a second lithography to pattern a second shape overlapping a portion of the first shape; processing the first shape and the second shape to form an isolation region at the overlap; and forming four regions separated by the isolation region. An intermediate semiconductor device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.