Susceptor design to reduce edge thermal peak
US10269614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2015 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | May 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.