Distributed multi-zone plasma source systems, methods and apparatus
US10283325B2 · kind B2 · utility
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53References
16Claims
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Key dates
| Filing date | Oct 10, 2012 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jan 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32669
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.