Patent · US Active

Electronic device with top side pin array and manufacturing method thereof

US10304697B2 · kind B2 · utility

4Cited by

3References

19Claims

0Family size

Assignee

Amkor Technology, Inc. · US

Inventors

Devarajan Balaraman · Apex, US
Daniel Richter · Radebeul, DE
Greg Hames · Dallas, US
Dean Zehnder · Hillsborough, US
Glenn Rinne · Apex, US

Key dates

Filing date	Oct 5, 2017
Grant date	May 28, 2019
Priority date	—
Expiry date	Oct 5, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.