Chemical control features in wafer process equipment

US10354843B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Qiwei Liang · Fremont, US
• Xinglong Chen · Ürümqi, CN
• Kien N. Chuc · Cupertino, US
• Dmitry Lubomirsky · Cupertino, US
• Soonam Park · Sunnyvale, US
• Jang-Gyoo Yang · San Jose, US
• Shankar Venkataraman · Santa Clara, US
• Toan Q. Tran · San Jose, US
• Kimberly Hinckley · Mountain View, US
• Saurabh Garg · Cupertino, US

Key dates

• Filing date: Apr 28, 2017
• Grant date: Jul 16, 2019
• Expiry date: Nov 16, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/002
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Gas distribution assemblies are described including an annular body, an upper plate, and a lower plate. The upper plate may define a first plurality of apertures, and the lower plate may define a second and third plurality of apertures. The upper and lower plates may be coupled with one another and the annular body such that the first and second apertures produce channels through the gas distribution assemblies, and a volume is defined between the upper and lower plates.