Patent · US Active

System for tunable workpiece biasing in a plasma reactor

US10373804B2 · kind B2 · utility

74Cited by
3References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 3, 2017
Grant dateAug 6, 2019
Priority date
Expiry dateFeb 3, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/334
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Systems and methods for tunable workpiece biasing in a plasma reactor are provided herein. In some embodiments, a system includes: a plasma chamber that performs plasma processing on a workpiece, a first pulsed voltage source, coupled directly to a workpiece, a second pulsed voltage source, coupled capacitively to the workpiece, and a biasing controller comprising one or more processors, and memory, wherein the memory comprises a set of computer instructions that when executed by the one or more processors, independently controls the first pulsed voltage source and the second pulsed voltage source based on one or more parameters of the first pulsed voltage source and the second pulsed voltage source in order to tailor ion energy distribution of the flux of ions directed to the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.