Gas systems and methods for chamber ports

US10381247B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Nagendra Madiwal · Bengaluru, IN
• Robert Irwin Decottignies · San Carlos, US
• Andrew Nguyen · San Jose, US
• Paul B. Reuter · Austin, US
• Angela Rose Sico · Round Rock, US
• Michael Kuchar · Georgetown, US
• Travis Morey · Austin, US
• Mitchell DiSanto · Georgetown, US

Key dates

• Filing date: Aug 16, 2016
• Grant date: Aug 13, 2019
• Expiry date: Mar 4, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49432
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An electronic device manufacturing system may include a chamber port assembly that provides an interface between a transfer chamber and a process chamber. In some embodiments, the chamber port assembly may be configured to direct a flow of purge gas into a substrate transfer area of the chamber port assembly. In other embodiments, a process chamber and/or the transfer chamber may be configured to direct a flow of purge gas into the substrate transfer area. The flow of purge gas into a substrate transfer area may prevent and/or reduce migration of particulate matter from chamber hardware onto a substrate being transferred between the transfer chamber and a process chamber. Methods of assembling a chamber port assembly are also provided, as are other aspects.