Advanced polishing pads having compositional gradients by use of an additive manufacturing process

US10399201B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sivapackia Ganapathiappan · Palo Alto, US
• Boyi Fu · San Jose, US
• Ashwin CHOCKALINGAM · San Jose, US
• Daniel Redfield · معلمی نژاد, US
• Rajeev Bajaj · Fremont, US
• Mahendra C. ORILALL · Downingtown, US
• Hou T. Ng · Campbell, US
• Jason Garcheung Fung · Sunnyvale, US
• Mayu YAMAMURA · San Mateo, US

Key dates

• Filing date: Oct 17, 2016
• Grant date: Sep 3, 2019
• Expiry date: Mar 31, 2037

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B33Y70/10
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments herein further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.