Inventor · San Jose, CA, US

Boyi Fu

27Patents
10h-index
41Co-inventors
67Inventor score

Filing activity: Oct 16, 2015 → Dec 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10211072B2 Method of reconstituted substrate formation for advanced packaging applications Electricity 32 Active
US10384330B2 Polishing pads produced by an additive manufacturing process Performing Operations; Transporting 20 Active
US10456886B2 Porous chemical mechanical polishing pads Performing Operations; Transporting 20 Active
US10399201B2 Advanced polishing pads having compositional gradients by use of an additive manufacturing process Performing Operations; Transporting 20 Active
US10391605B2 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process Performing Operations; Transporting 17 Active
US10618141B2 Apparatus for forming a polishing article that has a desired zeta potential Electricity 17 Active
US10821573B2 Polishing pads produced by an additive manufacturing process Performing Operations; Transporting 16 Active
US10875145B2 Polishing pads produced by an additive manufacturing process Performing Operations; Transporting 16 Active
US10953515B2 Apparatus and method of forming a polishing pads by use of an additive manufacturing process Performing Operations; Transporting 15 Active
US10875153B2 Advanced polishing pad materials and formulations Performing Operations; Transporting 15 Active
US10032827B2 Systems and methods for transfer of micro-devices Electricity 8 Active
US11724362B2 Polishing pads produced by an additive manufacturing process Performing Operations; Transporting 3 Active
US11745302B2 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process Performing Operations; Transporting 3 Active
US10692923B2 Systems and methods for transfer of micro-devices Electricity 2 Active
US11251226B2 Systems and methods for transfer of micro-devices Electricity 1 Active
US11446788B2 Precursor formulations for polishing pads produced by an additive manufacturing process Performing Operations; Transporting 1 Active
US11644617B1 Systems having fibers with antireflection coatings Physics 0 Active
US11685014B2 Formulations for advanced polishing pads Performing Operations; Transporting 0 Active
US11471999B2 Integrated abrasive polishing pads and manufacturing methods Electricity 0 Active
US11826876B2 Hydrophilic and zeta potential tunable chemical mechanical polishing pads Emerging Cross-Sectional Technologies 0 Active
US11843025B2 Methods for transfer of micro-devices Electricity 0 Active
US12157289B2 Seals for optical components Physics 0 Active
US11980992B2 Integrated abrasive polishing pads and manufacturing methods Electricity 0 Active
US11772229B2 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process Performing Operations; Transporting 0 Active
US12332430B2 Seals for optical components Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.