Local area polishing system and polishing pad assemblies for a polishing system
US10434623B2 · kind B2 · utility
0Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Mar 10, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.