Compositions and methods for selectively etching titanium nitride
US10472567B2 · kind B2 · utility
3Cited by
73References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2014 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Mar 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Semi-aqueous compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten and copper, and insulating materials from a microelectronic device having same thereon. The semi-aqueous compositions contain at least one oxidant, at least one etchant, and at least one organic solvent, may contain various corrosion inhibitors to ensure selectivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.