Patent · US Active

Copper microcooler structure and fabrication

US10490481B1 · kind B1 · utility

1Cited by

8References

20Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Fee Li Lie · Albany, US
Kamal K. Sikka · Poughkeepsie, US
Donald F. Canaperi · Bridgewater, US
Daniel A. Corliss · Cohoes, US
Dinesh Gupta · Hopewell Junction, US
Dario L. Goldfarb · Potsdam, US

Key dates

Filing date	Sep 17, 2018
Grant date	Nov 26, 2019
Priority date	—
Expiry date	Sep 17, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L24/09
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Techniques that facilitate a copper microcooler structure are provided. In one example, a device includes a first copper microcooler structure and a second copper microcooler structure. The first copper microcooler structure includes a first copper plate and a first set of copper channels attached to the first copper plate. The second copper microcooler structure includes a second copper plate and a second set of copper channels attached to the second copper plate. A surface of the second copper plate associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.