Fee Li Lie
173Patents
12h-index
109Co-inventors
85Inventor score
Filing activity: Jun 18, 2014 → Mar 21, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9608065B1 | Air gap spacer for metal gates | Electricity | 89 | Active |
| US9620590B1 | Nanosheet channel-to-source and drain isolation | Electricity | 86 | Active |
| US9805935B2 | Bottom source/drain silicidation for vertical field-effect transistor (FET) | Electricity | 27 | Active |
| US9748380B1 | Vertical transistor including a bottom source/drain region, a gate structure, and an air gap formed between the bottom source/drain region and the gate structure | Physics | 25 | Active |
| US9799765B1 | Formation of a bottom source-drain for vertical field-effect transistors | Electricity | 25 | Active |
| US9362179B1 | Method to form dual channel semiconductor material fins | Electricity | 24 | Active |
| US9472506B2 | Registration mark formation during sidewall image transfer process | Electricity | 22 | Active |
| US9842931B1 | Self-aligned shallow trench isolation and doping for vertical fin transistors | Electricity | 21 | Active |
| US9754798B1 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Electricity | 13 | Active |
| US9305845B2 | Self-aligned quadruple patterning process | Emerging Cross-Sectional Technologies | 13 | Active |
| US9450095B1 | Single spacer for complementary metal oxide semiconductor process flow | Electricity | 13 | Active |
| US10553522B1 | Semiconductor microcooler | Electricity | 12 | Active |
| US9853127B1 | Silicidation of bottom source/drain sheet using pinch-off sacrificial spacer process | Electricity | 12 | Active |
| US10002962B2 | Vertical FET structure | Electricity | 11 | Active |
| US9318574B2 | Method and structure for enabling high aspect ratio sacrificial gates | Electricity | 11 | Active |
| US9536750B1 | Method for fin formation with a self-aligned directed self-assembly process and cut-last scheme | Electricity | 10 | Active |
| US10304744B1 | Inverse tone direct print EUV lithography enabled by selective material deposition | Electricity | 9 | Active |
| US10074730B2 | Forming stacked nanowire semiconductor device | Electricity | 8 | Active |
| US10014391B2 | Vertical transport field effect transistor with precise gate length definition | Electricity | 8 | Active |
| US9755071B1 | Merged gate for vertical transistors | Electricity | 7 | Active |
| US9728622B1 | Dummy gate formation using spacer pull down hardmask | Electricity | 7 | Active |
| US9425196B1 | Multiple threshold voltage FinFETs | Electricity | 6 | Active |
| US10211316B2 | Silicidation of bottom source/drain sheet using pinch-off sacrificial spacer process | Electricity | 6 | Active |
| US9842739B2 | Method and structure for enabling high aspect ratio sacrificial gates | Electricity | 6 | Active |
| US9331148B1 | FinFET device with channel strain | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.