Semiconductor package with a through port for sensor applications

US10549985B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Dominic Maier · Pleystein, DE
• Matthias Steiert · Rosenheim, DE
• Chau Fatt Chiang · Melaka City, MY
• Christian Geissler · Teugn, DE
• Bernd Goller · Otterfing, DE
• Thomas Kilger · Regenstauf, DE
• Johannes Lodermeyer · Kinding, DE
• Franz-Xaver Muehlbauer · Rimbach, DE
• Chee Yang Ng · Kluang, MY
• Beng Keh See · Melaka City, MY
• Claus Waechter · Sinzing, DE

Key dates

• Filing date: Aug 31, 2017
• Grant date: Feb 4, 2020
• Expiry date: Aug 31, 2037

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0154
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.