Method for processing a workpiece using a multi-cycle thermal treatment process
US10573532B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 27, 2018 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Jun 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a workpiece is provided. The method can include placing a workpiece on a susceptor disposed within a processing chamber. The method can include performing a multi-cycle thermal treatment process on the workpiece in the processing chamber. The multi-cycle thermal treatment process can include at least two thermal cycles. Each thermal cycle of the at least two thermal cycles can include performing a first treatment on the workpiece at a first temperature; heating a device side surface of the workpiece to a second temperature in less than one second; performing a second treatment on the workpiece at approximately the second temperature; and cooling the workpiece subsequent to performing the second treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.