Textured small pad for chemical mechanical polishing
US10589399B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2017 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Oct 8, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.