Patent · US Active

Method for handling a product substrate and a bonded substrate system

US10600690B2 · kind B2 · utility

0Cited by

2References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Meyer-Berg · Birkenfeld, DE
Claus von Waechter · Sinzing, DE
Michael Bauer · Nittendorf, DE
Holger Doepke · Sinzing, DE
Dominic Maier · Pleystein, DE
Daniel Porwol · Straubing, DE
Tobias Schmidt · Munich, DE

Key dates

Filing date	Aug 13, 2018
Grant date	Mar 24, 2020
Priority date	—
Expiry date	Aug 13, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S156/941
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.