Polishing system with local area rate control and oscillation mode

US10610994B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Eric Lau · Santa Clara, US
• Hui Chen · Burlingame, US
• King Yi Heung · Union City, US
• Chih Chung Chou · San Jose, US
• Edwin C. Suarez · Pleasanton, US
• Garrett H. Sin · San Jose, US
• Charles C. Garretson · Sunnyvale, US
• Jeonghoon Oh · San Jose, US

Key dates

• Filing date: Mar 10, 2017
• Grant date: Apr 7, 2020
• Expiry date: Mar 10, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68785
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.