LDMOS transistor
US10665531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2019 |
| Grant date | May 26, 2020 |
| Priority date | — |
| Expiry date | Feb 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/112
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a semiconductor device includes a semiconductor substrate having a front surface, a lateral transistor arranged in the front surface of the semiconductor substrate and having an intrinsic source, and a through substrate via. A first conductive layer lines side walls of the through substrate via and extends from the through substrate via onto the front surface of the semiconductor substrate and is electrically coupled with the intrinsic source of the lateral transistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.