Patent · US Active

Method and device for plasma treatment of substrates

US10707059B2 · kind B2 · utility

0Cited by

3References

4Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Thomas Glinsner · Ried im Innkreis, AT
Christoph Flotgen · Pramerdorf, AT
Johann Bernauer · Ramstein-Miesenbach, DE
Thomas Wagenleitner · Lauterbrunn, AT
Thomas Wieser · Kirchdorf am Inn, DE
Florian Schmid · Ried im Innkreis, AT
Thomas Plach · Linz, AT
Roman Anzengruber · Ried im Innkreis, AT
Alexander Nones · Obernberg am Inn, AT
Uwe Kriebisch · Ried im Innkreis, AT

Key dates

Filing date	May 9, 2014
Grant date	Jul 7, 2020
Priority date	—
Expiry date	Jul 6, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68785
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A device for bombarding at least one substrate with a plasma with a first electrode and a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.