Measurement processing device, substrate processing system, measurement jig, measurement processing method, and storage medium
US10713772B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Nov 24, 2015 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Sep 16, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.