Substrate support with increasing areal density and corresponding method of fabricating
US10832936B2 · kind B2 · utility
1Cited by
9References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 27, 2016 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate support for a substrate processing system is provided and includes a body and mesas. The mesas are distributed across and extending from and in a direction away from the body. The mesas are configured to support a substrate. Each of the mesas includes a surface area that contacts and supports the substrate. Areal density of the mesas monotonically increases as a radial distance from a center of the substrate support increases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.