Semiconductor package system

US10886186B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thorsten Scharf · Regensburg, DE
• Ralf Otremba · Kaufbeuren, DE
• Thomas Bemmerl · Schwandorf, DE
• Irmgard Escher-Poeppel · Regensburg, DE
• Martin Gruber · Schwandorf, DE
• Michael Juerss · Regenstauf, DE
• Thorsten Meyer · Regensburg, DE
• Xaver Schloegel · Sachsenkam, DE

Key dates

• Filing date: Mar 27, 2019
• Grant date: Jan 5, 2021
• Expiry date: Mar 27, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.