Substrate support with electrically floating power supply
US10904996B2 · kind B2 · utility
38Cited by
25References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Feb 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/3494
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide pulsed DC voltage, and methods of applying a pulsed DC voltage, to a substrate during plasma assisted or plasma enhanced semiconductor manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.