Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same

US10916472B2 · kind B2 · utility

Assignee

• TOKYO ELECTRON LIMITED · JP

Inventors

• Robert D. Clark · Norman, US
• Jeffrey Smith · Clifton Park, US
• Kandabara Tapily · Mechanicville, US
• Angelique Raley · Halfmoon, US
• Qiang Zhao · Milpitas, US

Key dates

• Filing date: Mar 18, 2019
• Grant date: Feb 9, 2021
• Expiry date: Mar 18, 2039

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P90/80
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

This disclosure relates to a high volume manufacturing system for processing and measuring workpieces in a semiconductor processing sequence without leaving the system's controlled environment (e.g., sub-atmospheric pressure). The system includes an active interdiction control system to implement corrective processing within the system when a non-conformity is detected. The corrective processing can include a remedial process sequence to correct the non-conformity or compensate for the non-conformity during subsequent process. The non-conformity may be associated with fabrication measurement data, process parameter data, and/or platform performance data.