Low density polishing pad
US10946495B2 · kind B2 · utility
0Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Mar 17, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2475/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.