Ceramic heater and esc with enhanced wafer edge performance
US10950477B2 · kind B2 · utility
264Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2016 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Jun 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure provide an improved electrostatic chuck for supporting a substrate. The electrostatic chuck comprises a chuck body coupled to a support stem, the chuck body having a substrate supporting surface, a plurality of tabs projecting from the substrate supporting surface of the chuck body, wherein the tabs are disposed around the circumference of the chuck body, an electrode embedded within the chuck body, the electrode extending radially from a center of the chuck body to a region beyond the plurality of tabs, and an RF power source coupled to the electrode through a first electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.