Patent · US Active

Device and method for bonding substrates

US11020951B2 · kind B2 · utility

0Cited by

5References

7Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Thomas Wagenleitner · Lauterbrunn, AT
Markus Wimplinger · Ried im Innkreis, AT
Friedrich Paul Lindner · Ried im Innkreis, AT
Thomas Plach · Linz, AT
Florian Kurz · Ried im Innkreis, AT

Key dates

Filing date	Mar 19, 2019
Grant date	Jun 1, 2021
Priority date	—
Expiry date	Mar 19, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/17
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.