Feed-forward of multi-layer and multi-process information using XPS and XRF technologies
US11029148B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2020 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | May 12, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for feed-forward of multi-layer and multi-process information using XPS and XRF technologies are disclosed. In an example, a method of thin film characterization includes measuring first XPS and XRF intensity signals for a sample having a first layer above a substrate. The first XPS and XRF intensity signals include information for the first layer and for the substrate. The method also involves determining a thickness of the first layer based on the first XPS and XRF intensity signals. The method also involves combining the information for the first layer and for the substrate to estimate an effective substrate. The method also involves measuring second XPS and XRF intensity signals for a sample having a second layer above the first layer above the substrate. The second XPS and XRF intensity signals include information for the second layer, for the first layer and for the substrate. The method also involves determining a thickness of the second layer based on the second XPS and XRF intensity signals, the thickness accounting for the effective substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.