Biased cover ring for a substrate processing system

US11049701B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Adolph Miller Allen · Oakland, US
• William Johanson · Gilroy, US
• Viachslav Babayan · Sunnyvale, US
• Zhong Qiang Hua · San Jose, US
• Carl Johnson · Minneapolis, US
• Vanessa Faune · San Jose, US
• Jingjing Liu · Shanghai, CN
• Vaibhav Soni · Austin, US
• Kirankumar Neelasandra SAVANDAIAH · Bengaluru, IN
• Sundarapandian Ramalinga Vijayalakshmi REDDY · Kanchinakote, IN

Key dates

• Filing date: Nov 27, 2017
• Grant date: Jun 29, 2021
• Expiry date: Jan 21, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/026
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.