Semiconductor microcooler

US11049789B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Donald F. Canaperi · Bridgewater, US
• Daniel A. Corliss · Cohoes, US
• Dario L. Goldfarb · Potsdam, US
• Dinesh Gupta · Hopewell Junction, US
• Fee Li Lie · Albany, US
• Kamal K. Sikka · Poughkeepsie, US

Key dates

• Filing date: Dec 13, 2019
• Grant date: Jun 29, 2021
• Expiry date: Dec 13, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A stacked semiconductor microcooler includes a first microcooler and a second microcooler. The microcoolers may be positioned such that the fins of each microcooler are vertically aligned. The microcoolers may include an inlet passage to accept coolant and an outlet passage to expel the coolant. One or more microcoolers may be thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the passages and heat from the one or more microcoolers may transfer to the liquid coolant.