Semiconductor microcooler
US11056418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Dec 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked semiconductor microcooler includes a first and second semiconductor microcooler. Each microcooler includes silicon fins extending from a silicon substrate. A metal layer may be formed upon the fins. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.