Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same
US11094653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Nov 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80986
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonded assembly and a method of forming a bonded assembly includes providing a first semiconductor die including a first substrate, first semiconductor devices, and first bonding pads that are electrically connected to a respective node of the first semiconductor devices, providing a second semiconductor die including a second substrate, second semiconductor devices, and second bonding pads that are electrically connected to a respective node of the second semiconductor devices, forming a dielectric bonding pattern definition layer including bonding pattern definition openings therethrough over the second bonding pads, and bonding the second bonding pads to the first bonding pads, where the first metal pads expand through the bonding pattern definition openings and are bonded to a respective one of the second bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.