Patent · US Active

Bonded assembly containing laterally bonded bonding pads and methods of forming the same

US11239204B2 · kind B2 · utility

0Cited by

9References

20Claims

0Family size

Assignee

Sandisk Technologies, Inc. · US

Inventors

Chen Wu · Leuven, BE
Peter Rabkin · Cupertino, US
Yangyin Chen · Leuven, BE
Masaaki Higashitani · Cupertino, US

Key dates

Filing date	Nov 25, 2019
Grant date	Feb 1, 2022
Priority date	—
Expiry date	Apr 14, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10B43/27
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A bonded assembly includes a first die containing first bonding pads having sidewalls that are laterally bonded to sidewalls of second bonding pads of a second die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.