Cleaning components and methods in a plating system

US11241718B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Joseph Antony Jonathan · Kalispell, US
• Kyle M. Hanson · Kalispell, US
• Jason Rye · Kalispell, US
• James Emery Brown · Tucson, US
• Gregory J. Wilson · Kalispell, US
• Eric J. Bergman · Kalispell, US
• Tricia Youngbull · Whitefish, US
• Timothy G. Stolt · Kalispell, US

Key dates

• Filing date: Apr 17, 2019
• Grant date: Feb 8, 2022
• Expiry date: Apr 27, 2040

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D21/08
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.