Plasma treatment method to enhance surface adhesion for lithography
US11243465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2018 |
| Grant date | Feb 8, 2022 |
| Priority date | — |
| Expiry date | Oct 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0276
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of methods for patterning using enhancement of surface adhesion are presented. In an embodiment, a method for patterning using enhancement of surface adhesion may include providing an input substrate with an anti-reflective coating layer and an underlying layer. Such a method may also include performing a surface adhesion modification process on the substrate, the surface adhesion modification process utilizing a plasma treatment configured to increase an adhesion property of an anti-reflective coating layer without affecting downstream processes. In an embodiment, the method may also include performing a photoresist coating process, a mask exposure process, and a developing process to generate a target patterned structure in a photoresist layer on the substrate. In such embodiments, the method may include controlling operating parameters of the surface adhesion modification process to achieve target profiles of the patterned structure and substrate throughput objectives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.