Lior Huli
21Patents
2h-index
31Co-inventors
53Inventor score
Filing activity: Apr 17, 2013 → Jun 16, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10770294B2 | Selective atomic layer deposition (ALD) of protective caps to enhance extreme ultra-violet (EUV) etch resistance | Electricity | 3 | Active |
| US9991133B2 | Method for etch-based planarization of a substrate | Electricity | 3 | Active |
| US8975009B2 | Track processing to remove organic films in directed self-assembly chemo-epitaxy applications | Physics | 2 | Active |
| US9711419B2 | Substrate backside texturing | Electricity | 2 | Active |
| US9281251B2 | Substrate backside texturing | Electricity | 2 | Active |
| US11482454B2 | Methods for forming self-aligned contacts using spin-on silicon carbide | Electricity | 1 | Active |
| US10141183B2 | Methods of spin-on deposition of metal oxides | Electricity | 1 | Active |
| US9086631B2 | EUV resist sensitivity reduction | Physics | 1 | Active |
| US10403501B2 | High-purity dispense system | Performing Operations; Transporting | 1 | Active |
| US9791779B2 | EUV resist etch durability improvement and pattern collapse mitigation | Electricity | 1 | Active |
| US12406887B2 | Selective film formation using a self-assembled monolayer | Electricity | 0 | Active |
| US11762297B2 | Point-of-use blending of rinse solutions to mitigate pattern collapse | Electricity | 0 | Active |
| US10685857B2 | Dispense nozzle with a shielding device | Electricity | 0 | Active |
| US10354872B2 | High-precision dispense system with meniscus control | Performing Operations; Transporting | 0 | Active |
| US11383211B2 | Point-of-use dynamic concentration delivery system with high flow and high uniformity | Performing Operations; Transporting | 0 | Active |
| US12080599B2 | Methods for forming self-aligned contacts using spin-on silicon carbide | Electricity | 0 | Active |
| US10935889B2 | Extreme ultra-violet sensitivity reduction using shrink and growth method | Physics | 0 | Active |
| US11243465B2 | Plasma treatment method to enhance surface adhesion for lithography | Electricity | 0 | Active |
| US12216400B2 | Directed self-assembly | Performing Operations; Transporting | 0 | Active |
| US12193231B2 | Fabricating three-dimensional semiconductor structures | Electricity | 0 | Active |
| US12393121B2 | Point-of-use blending of rinse solutions for EUV processing to mitigate pattern collapse | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.