Patent · US Active

Retaining ring with shaped surface

US11260500B2 · kind B2 · utility

3Cited by
41References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 3, 2020
Grant dateMar 1, 2022
Priority date
Expiry dateSep 3, 2040

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49815
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.