Embedded bonded assembly and method for making the same
US11276705B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
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Key dates
| Filing date | Aug 27, 2019 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Jan 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/27
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure includes a first semiconductor die containing a recesses, and a second semiconductor die which is embedded in the recess in the first semiconductor die and is bonded to the first semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.