Processing of workpieces using ozone gas and hydrogen radicals
US11315801B2 · kind B2 · utility
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11References
19Claims
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Key dates
| Filing date | May 21, 2021 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | May 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32138
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for processing a workpiece are provided. The workpiece can include a ruthenium layer and a copper layer. In one example implementation, a method for processing a workpiece can include supporting a workpiece on a workpiece support. The method can include performing an ozone etch process on the workpiece to at least a portion of the ruthenium layer. The method can also include performing a hydrogen radical treatment process on a workpiece to remove at least a portion of an oxide layer on the copper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.