Interfacial tilt-resistant bonded assembly and methods for forming the same
US11348901B1 · kind B1 · utility
3Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Nov 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first bonding unit is provided, which includes a first substrate, a first passivation dielectric layer, and first bonding pads. A second bonding unit is provided, which includes a second substrate, a second passivation dielectric layer, and second bonding pads including bonding pillar structures. Solder material portions are formed on physically exposed surfaces of the first bonding pads. The second bonding unit is attached to the first bonding unit by bonding the at least one of the bonding pillar structures to a respective solder material portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.