Three-dimensional microelectronic package with embedded cooling channels

US11462512B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Kamal K. Sikka · Poughkeepsie, US
• Fee Li Lie · Albany, US
• Kevin R. Winstel · East Greenbush, US
• Ravi K. Bonam · Albany, US
• Iqbal Rashid Saraf · Wappingers Falls, US
• Dario L. Goldfarb · Potsdam, US
• Daniel A. Corliss · Cohoes, US
• Dinesh Gupta · Hopewell Junction, US

Key dates

• Filing date: Dec 28, 2020
• Grant date: Oct 4, 2022
• Expiry date: Dec 28, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The subject disclosure relates to 3D microelectronic chip packages with embedded coolant channels. The disclosed 3D microelectronic chip packages provide a complete and practical mechanism for introducing cooling channels within the 3D chip stack while maintaining the electrical connection through the chip stack. According to an embodiment, a microelectronic package is provided that comprises a first silicon chip comprising first coolant channels interspersed between first thru-silicon-vias (TSVs). The microelectronic chip package further comprises a silicon cap attached to a first surface of the first silicon chip, the silicon cap comprising second TSVs that connect to the first TSVs. A second silicon chip comprising second coolant channels can further be attached to the silicon cap via interconnects formed between a first surface of the second silicon chip and the silicon cap, wherein the interconnects connect to the second TSVs.