Patent · US Active

Lead frame-based semiconductor package

US11469161B2 · kind B2 · utility

0Cited by

1References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Scharf · Regensburg, DE
Chan Lam Cha · Melaka City, MY
Wolfgang Hetzel · Nattheim, DE
Swee Kah Lee · Melaka City, MY
Stefan Macheiner · Kissing, DE

Key dates

Filing date	Aug 27, 2020
Grant date	Oct 11, 2022
Priority date	—
Expiry date	Nov 24, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes: a lead frame having a plurality of blocks of uniform size and laterally spaced apart from one another with uniform spacing; a first semiconductor die attached to a first group of the blocks; electrical conductors connecting a plurality of input/output (I/O) terminals of the first semiconductor die to a second group of the blocks, at least some blocks of the second group being laterally spaced outward from the blocks of the first group; and a mold compound encapsulating the first semiconductor die and the electrical conductors. Corresponding methods of producing the semiconductor package are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.