Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect

US11488921B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ali Roshanghias · Villach, AT
• Alfred Binder · Zwischenbergen, AT
• Barbara Eichinger · Villach, AT
• Stefan Karner · Blindenmarkt, AT
• Martin Mischitz · Wernberg, AT
• Rainer Pelzer · Wernberg, AT

Key dates

• Filing date: Oct 1, 2020
• Grant date: Nov 1, 2022
• Expiry date: Nov 18, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A multi-chip device is provided. The multi-chip device includes a first chip, a second chip mounted on the first chip, and a hardened printed or sprayed electrically conductive material forming a sintered electrically conductive interface between the first chip and the second chip.