Barbara Eichinger
7Patents
2h-index
23Co-inventors
43Inventor score
Filing activity: Nov 30, 2015 → Sep 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9620466B1 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Electricity | 3 | Active |
| US9929111B2 | Method of manufacturing a layer structure having partially sealed pores | Electricity | 2 | Active |
| US11756923B2 | High density and durable semiconductor device interconnect | Electricity | 0 | Active |
| US11552048B2 | Semiconductor device including an electrical contact with a metal layer arranged thereon | Electricity | 0 | Active |
| US10199372B2 | Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures | Electricity | 0 | Active |
| US11329021B2 | Method for fabricating a semiconductor device comprising a paste layer and semiconductor device | Electricity | 0 | Active |
| US11488921B2 | Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.