Integrated epitaxial metal electrodes
US11495670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2019 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | May 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/814
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are described herein to include an epitaxial metal layer between a rare earth oxide and a semiconductor layer. Systems and methods are described to grow a layered structure, comprising a substrate, a first rare earth oxide layer epitaxially grown over the substrate, a first metal layer epitaxially grown over the rare earth oxide layer, and a first semiconductor layer epitaxially grown over the first metal layer. Specifically, the substrate may include a porous portion, which is usually aligned with the metal layer, with or without a rare earth oxide layer in between.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.